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Title:Lumped equivalent-circuit modeling of transmission lines on microchip silicon substrate
Author(s):Shah, Milan
Contributor(s):Zhou, Jin
Subject(s):Microstrip
Transmission Line
Modeling
Equivalent Circuits
Electromagnetic Simulation
RLGC Parameters
S Parameters
Interconnect
Abstract:Interconnect is a fundamental component required in any integrated circuit design. For specific applications, or at high enough frequencies, it is necessary to model interconnect as a transmission line. However, not all circuit simulators support the use of transmission lines in the design space, creating a need for effective lumped element models for transmission lines. This thesis examines different lumped element models derived for interconnect transmission lines. The models are composed from the RLGC parameters extracted from an electromagnetic simulation, and the resulting equivalent circuit is analyzed. It is ultimately shown that, of the models observed, an empirical model produces the behavior most similar to the electromagnetic simulation.
Issue Date:2018-12
Genre:Other
Type:Text
Language:English
URI:http://hdl.handle.net/2142/105412
Date Available in IDEALS:2019-09-04


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