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Title:Interfacial adhesion of thin film high energy density anode materials
Author(s):Diamond, Jacob M.
Advisor(s):Sottos, Nancy R.
Department / Program:Materials Science and Engineering
Discipline:Materials Science and Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Thin Films
Structured Anodes
Laser Spallation
Abstract:Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.
Issue Date:2020-10-21
Rights Information:Copyright 2020 Jacob Diamond
Date Available in IDEALS:2021-03-05
Date Deposited:2020-12

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