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Title:Fracture mechanics for interfacial crack between adhesively bonded dissimilar materials
Author(s):Wang, Charles Yi-jer
Subject(s):Fracture Mechanics
Interfacial Crack
Adhesively Bonded Dissimilar Materials
Abstract:A plate composed of two dissimilar materials, bonded together along a straight line with a center crack was studied. This problem represents an idealization of an adhesive joint or a composite structure with an interfacial flaw or crack caused by faulty joining techniques. Common examples are imperfections, voids, or broken bonds on the composite interface. Combined with the finite element technique, the strain energy method and the J-integral method have been extended to a bi-material problem to calculate the value of the strain energy rate, G. A general relationship between strain energy rate, G, and total stress intensity factor, K, is then derived using the crack closure technique. The ratio of stress intensity factors, KII/KI, was also examined. The numerical analysis concentrated on three categories of composite materials with moduli ratio, E2/E1 = 1, 20, and 120. These results provide a complete crack-tip stress analysis and are needed for the study and understanding of the fracture mechanics of bi-material problems. Lastly, the compliance method was employed for experimental verification of the numerical results. An aluminum alloy-epoxy bi-material plate with a moduli ratio equal to 20 was examined. This study has yielded useful results in terms of the analytical tools to guide further experimental fracture studies of adhesive joints and composite materials.
Issue Date:1972-03
Publisher:Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report:TAM R 353
Genre:Technical Report
Sponsor:Naval Air Systems Command, Contract No. N00019-72-C-0274
Rights Information:Copyright 1972 Board of Trustees of the University of Illinois
Date Available in IDEALS:2021-11-04

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  • Technical Reports - Theoretical and Applied Mechanics (TAM)
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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