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Title:Elasto plastic analysis of peel test
Author(s):Kim, Kyung-Suk
Subject(s):Peel Test
Elasto Plasto Analysis
Abstract:In the first year (1984) study of this project (Project #: IBM Peel Test, UI account #1-5-37119), an analytic method has been developed to analyze the elasto-plastic deformation of thin films in peeling process. With the analytic method, we could extract the adhesion bond energy from the peel-test values of thin (1 μm ~ 1 mm) metallic films. The validity of the analysis was verified by numerical and experimental analysis. The experimental analysis has been carried out by Dr. J. I. Kim of IBM independently. These studies extended the applicability of peel test from elastic peeling to elasto-plastic peeling. In particular, the analytic result strongly supports the validity of peel test with large amount of ductility (plasticity) that is inevitable in peel test of thin metallic films with strong adhesion. In particular, universal peel diagram is invented in this study. On the single universal peel diagram, interrelations of peel strength and adhesion energy can be readily read for all combinations of the material properties and the geometry (thickness of the adherend) of the specimen. In addition, the peel strength can be easily converted to pull strength using this diagram. The theory and the analytic results agree excellently with experimental results. (The experimental information was provided by Drs. L. Lee, P. Geldermans and J. Kim of IBM.)
Issue Date:1985-03
Publisher:Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report:TAM R 472
Genre:Technical Report
Sponsor:IBM Corp 85/03 IBM PEEL TEST 44 1614 85/03
Rights Information:Copyright 1985 Board of Trustees of the University of Illinois
Date Available in IDEALS:2021-11-04

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  • Technical Reports - Theoretical and Applied Mechanics (TAM)
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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