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Title:Thermoelastic properties of plain weave composites for multilayer circuit board applications
Author(s):Sottos, Nancy R.; Ockers, J.M.; Swinderman, M.J.
Subject(s):Plain Weave Composites
Multilayer Circuit Board Applications
Thermoelastic Properties
Issue Date:1995-05
Publisher:Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report:TAM R 794
1995-6016
Genre:Technical Report
Type:Text
Language:English
URI:http://hdl.handle.net/2142/112491
ISSN:0073-5264
Rights Information:Copyright 1995 Board of Trustees of the University of Illinois
Date Available in IDEALS:2021-11-04


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  • Technical Reports - Theoretical and Applied Mechanics (TAM)
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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