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Title:Creep and relaxation behavior of woven glass/epoxy substrates for multilayer circuit board applications
Author(s):Shrotriya, P.; Sottos, Nancy R.
Subject(s):Creep Behavior
Dynamic Mechanical Analysis
Abstract:The creep behavior of a common woven glass/epoxy composite substrate for multilayer circuit board applications was characterized using dynamic mechanical analysis (DMA). The creep compliance was measured in both the warp and fill directions of the composite over a temperature range of 30 to 155 C. The creep compliance of the neat FR-4 epoxy matrix was also characterized for comparison with the composite response. Master creep curves were obtained for the neat resin and the composite in the warp and fill directions assuming thermorheologically simple behavior and applying the time-temperature-superposition principle. The creep data was fit to a Prony series and then converted to relaxation data in the Laplace domain. Micromechanical models were eveloped to predict the relaxation behavior of the woven glass/epoxy compiste from the elastic properties and the geometry of the glass fabric and relaxation behavaior of the neat resin. Model predictions were compared with experimental data.
Issue Date:1997-10
Publisher:Department of Theoretical and Applied Mechanics. College of Engineering. University of Illinois at Urbana-Champaign
Series/Report:TAM R 870
Genre:Technical Report
Rights Information:Copyright 1997 Board of Trustees of the University of Illinois
Date Available in IDEALS:2021-11-04

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  • Technical Reports - Theoretical and Applied Mechanics (TAM)
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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