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Title:Finite element modeling of cutting and burnishing processes at micro- and nanoscales
Author(s):Zhou, Qinan
Advisor(s):Ferreira , Placid M.
Department / Program:Mechanical Sci & Engineering
Discipline:Mechanical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:M.S.
Genre:Thesis
Subject(s):finite element modeling
cutting process
burnishing process
nanoscale
Abstract:Micro/nano cutting and micro/nano burnishing processes are widely used in the field of manufacturing. Compared to their counterparts in the conventional scale, micro/nano cutting and burnishing processes have unique characteristics. First, there are various size effects, such as the edge radius, microstructure, and feature size effects. Second, the transition between these two processes based on the relative tool sharpness exists at the micro- and nanoscales. Third, the specific cutting energy changes nonlinearly as the uncut chip thickness changes, due to the material strengthening. All these phenomena are hard to describe analytically. Thus, finite element analysis is utilized to numerically model the micro/nano cutting and micro/nano burnishing processes. The coupled Eulerian-Lagrangian method is used for modeling the micro/nano cutting process to avoid excessive distortion of meshes, while the Lagrangian formulation is used for modeling the micro/nano burnishing process to capture the resulting workpiece geometries directly. Based on these numerical simulations, in the micro/nano cutting process, both the cutting and thrust forces decrease, if the edge radius decreases, the cutting velocity decreases, the uncut chip thickness decreases, or the effective rake angle increases. In the micro/nano burnishing process, the effects of the indentation depth, tip radius, shallow angle, and steep angle on various quantities related to workpiece profiles, such as the valley depth after material recovery, average peak height, average peak-to-valley depth, and groove width, are studied.
Issue Date:2021-07-22
Type:Thesis
URI:http://hdl.handle.net/2142/113095
Rights Information:Copyright 2021 Qinan Zhou
Date Available in IDEALS:2022-01-12
Date Deposited:2021-08


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