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Title:Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits
Author(s):Sheikh, Zuhaib B.
Advisor(s):Cangellaris, Andreas C.
Department / Program:Electrical & Computer Eng
Discipline:Electrical & Computer Engr
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Transmission Line Model
Multi-conductor Interconnects
Two-dimensional RLCG extractor
Rational Fitting Algorithm
Abstract:Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.
Issue Date:2011-01-14
Rights Information:Copyright 2010 Zuhaib B. Sheikh
Date Available in IDEALS:2011-01-14
Date Deposited:December 2

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