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Title:Microstructural studies of vapor-deposited nickel/ceramic composites
Author(s):Shah, Mihir Mahendra
Doctoral Committee Chair(s):Rigsbee, J. Michael
Department / Program:Materials Science and Engineering
Discipline:Materials Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Materials Science
Abstract:This research program examines fundamental aspects of metal/ceramic interactions through the analysis of model composites produced by plasma-assisted physical vapor deposition (ion plating) and consisting of thin ($<$1 micrometer) metallic films on a ceramic substrate. The two major aspects of this research are: (1) the investigation of the effects of ion bombardment on the nucleation behavior and growth morphologies of the films, as well as the development of any film/substrate orientation relationships; and (2) the study of the interactions between metals and ceramics in a thin-film geometry, with emphasis on interface compound formation, comparing ion-assisted and high temperature processing.
The primary microanalytical technique employed was cross-sectional transmission electron microscopy, with scanning electron microscopy and Auger electron spectroscopy utilized as well. In addition, a tensile adhesion test and microhardness indentations were used to qualify mechanical strength.
An optimal processing window was defined for DC ion plating in the nickel/cordierite system in order to obtain maximum film/substrate adhesion. For the case of RF ion plating of nickel films on basal orientation sapphire substrates, ion bombardment during deposition was shown to have significant effects on the nucleation and growth behavior of the films. Bombardment enhanced adatom mobility was sufficient to result in a crystallographic orientation relationship between the film and the substrate, with close packed planes and directions being parallel. Ion bombardment was not sufficient, however, to produce any interfacial reaction phases in the as-deposited condition. A nickel aluminate spinel did form at the interface upon heat treatment (1000$\sp\circ$C, 2 hrs.) and was always crystallographically related to the substrate, independent of the as-deposited crystallography. Qualitatively, metallic films were more resistant to disbonding than oxide films, with a strong interface being achieved via ion-assisted deposition.
Issue Date:1990
Rights Information:Copyright 1990 Shah, Mihir Mahendra
Date Available in IDEALS:2011-05-07
Identifier in Online Catalog:AAI9021755
OCLC Identifier:(UMI)AAI9021755

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