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Evolution of surface waviness in thin films via volume and surface diffusion

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Title: Evolution of surface waviness in thin films via volume and surface diffusion
Author(s): Panat, Rahul P.; Hsia, K. Jimmy; Cahill, David G.
Abstract: Deformation mechanisms involving mass transport by stress driven diffusion influence a large number of technological problems. We study the formation of undulations on surfaces of stressed films at high temperature by exploring the deformation kinetics governed by volume and surface diffusion. A governing equation is derived that gives the amplitude change of such surfaces as a function of time. A parametric study is then carried out using a range of practically important input values of the film material properties. The results show that at the dominant instability wavelength, under low stress and high temperature conditions, the roughening is only caused by volume diffusion, while smoothing is only caused by surface diffusion. The results from the current model are compared to experimental observations reported in the literature for the roughening of metallic film surfaces under the low stress and high temperature conditions common in thermal barrier systems.
Issue Date: 2004-03
Publisher: Department of Theoretical and Applied Mechanics (UIUC)
Series/Report: TAM Reports 1044
Genre: Technical ReportArticle
Type: Text
Language: English
URI: http://hdl.handle.net/2142/240
ISSN: 0073-5264
Publication Status: published or submitted for publication
Peer Reviewed: is peer reviewed
Date Available in IDEALS: 2007-03-08
Is Version Of: Published as: Rahul P. Panat, K. Jimmy Hsia, and David G. Cahill. (2005) Evolution of surface waviness in thin films via volume and surface diffusion. Journal of Applied Physics, 97:13521 and may be found at http://link.aip.org/link/?jap/97/13521. DOI: 10.1063/1.1827920. Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.
 

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  • Theoretical and Applied Mechanics (TAM) Technical Reports
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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