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Title:Charged device model electrostatic discharge failures in system on a chip and system in a package designs
Author(s):Olson, Nicholas A.
Director of Research:Rosenbaum, Elyse
Doctoral Committee Chair(s):Rosenbaum, Elyse
Doctoral Committee Member(s):Feng, Milton; Shanbhag, Naresh R.; Schutt-Ainé, José E.
Department / Program:Electrical & Computer Eng
Discipline:Electrical & Computer Engr
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Charged Device Model
Charged Device Model (CDM)
Electrostatic Discharge (ESD)
Electrostatic Discharge
System on a Chip
System in a Package
Abstract:Advances in integrated circuit design and packaging techniques have introduced new ESD-susceptible (Electrostatic Discharge) circuit interfaces. This document will introduce these interfaces and the methods that were used to investigate their ESD robustness. Two test chips were designed to aid the analysis. The specialized design choices that allow for distinguishing between multiple failure locations are thoroughly illustrated. The testing plan is detailed and the test chip measurement results are analyzed. The results will compare different ESD protection techniques and illustrate the importance of having ESD protection at these interfaces. The results will also show how some interfaces are inherently more robust than others during a CDM (Charged Device Model) event. Finally, the effects on the intensity of the CDM stress based on single-die or stacked-die packages will be compared.
Issue Date:2011-05-25
Rights Information:Copyright 2011 Nicholas A. Olson
Date Available in IDEALS:2011-05-25
Date Deposited:2011-05

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