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Title:Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures
Author(s):Hu, Jie
Director of Research:Yu, Min-Feng
Doctoral Committee Chair(s):Yu, Min-Feng
Doctoral Committee Member(s):Ferreira, Placid M.; King, William P.; Kim, Kyekyoon
Department / Program:Mechanical Sci & Engineering
Discipline:Mechanical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Meniscus-confined Electrodeposition
Wire Bonding
3-D Structures
Abstract:A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes in an ambient air environment. This technique is cost-effective to implement and is based on the principle of electrodeposition, and can thus be applied to fabricate structures made of a wide variety of materials. In this work, theoretically, a detailed analysis was provided for describing the growth parameters essential for the meniscus-confined electrodeposition process; experimentally, various techniques were developed to fabricate structures with demanding shapes and dimensions for specific electrical and electrochemical applications.
Issue Date:2011-05-25
Rights Information:Copyright 2011 Jie Hu
Date Available in IDEALS:2013-05-26
Date Deposited:2011-05

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