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Description
Title: | Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures |
Author(s): | Hu, Jie |
Director of Research: | Yu, Min-Feng |
Doctoral Committee Chair(s): | Yu, Min-Feng |
Doctoral Committee Member(s): | Ferreira, Placid M.; King, William P.; Kim, Kyekyoon |
Department / Program: | Mechanical Sci & Engineering |
Discipline: | Mechanical Engineering |
Degree Granting Institution: | University of Illinois at Urbana-Champaign |
Degree: | Ph.D. |
Genre: | Dissertation |
Subject(s): | Meniscus-confined Electrodeposition
Nanoprobes Wire Bonding 3-D Structures |
Abstract: | A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes in an ambient air environment. This technique is cost-effective to implement and is based on the principle of electrodeposition, and can thus be applied to fabricate structures made of a wide variety of materials. In this work, theoretically, a detailed analysis was provided for describing the growth parameters essential for the meniscus-confined electrodeposition process; experimentally, various techniques were developed to fabricate structures with demanding shapes and dimensions for specific electrical and electrochemical applications. |
Issue Date: | 2011-05-25 |
URI: | http://hdl.handle.net/2142/24476 |
Rights Information: | Copyright 2011 Jie Hu |
Date Available in IDEALS: | 2013-05-26 |
Date Deposited: | 2011-05 |
This item appears in the following Collection(s)
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Graduate Dissertations and Theses at Illinois
Graduate Theses and Dissertations at Illinois -
Dissertations and Theses - Mechanical Science and Engineering