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Title:Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading
Author(s):Liu, Ming; Hsia, K. Jimmy
Subject(s):experimental solid mechanics
Abstract:Evaluation of crack tip driving force for interfacial cracks between piezoelectric actuators and elastic substrates is crucial to successful applications of smart materials and smart structures. Here the behavior of an interfacial crack between a piezoelectric material and an elastic material in under in-plane loading is studies. The displacement mismatch along a bonded interface due to electric potential loading on the piezoelectric material is modeled by an array of uniformly distributed dislocations along the interface. Using Fourier transformation method, the governing equations are converted to an integral equation, which is then converted to a standard Hilbert problem. A closed form solution for stresses, electric field, and electric displacements along the bonded interface is obtained. The results agree very well with that from numerical simulations using the finite element method. The results show that the closed form solution is not only accurate for far field distributions of stresses and electric variables, but also accurate for the asymptotic distributions near the crack tip. The solution also suggests the likelihood of domain switch in the piezoelectric material near the crack tip.
Issue Date:2001-12
Publisher:Department of Theoretical and Applied Mechanics (UIUC)
Series/Report:TAM Reports 992
Genre:Technical Report
Publication Status:published or submitted for publication
Peer Reviewed:is peer reviewed
Date Available in IDEALS:2007-03-08
Is Version Of:Published as: Ming Liu and K. Jimmy Hsia. Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading. Journal of the Mechanics and Physics of Solids, vol. 51, No. 5, 2003, pp 921-944. DOI: 10.1016/S0022-5096(02)00120-5. Copyright 2003 Elsevier Science

This item appears in the following Collection(s)

  • Technical Reports - Theoretical and Applied Mechanics (TAM)
    TAM technical reports include manuscripts intended for publication, theses judged to have general interest, notes prepared for short courses, symposia compiled from outstanding undergraduate projects, and reports prepared for research-sponsoring agencies.

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