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Title:Signal integrity analysis of high-speed multilayer interconnects using the finite element method
Author(s):Lu, Tianjian
Advisor(s):Jin, Jianming
Department / Program:Electrical & Computer Eng
Discipline:Electrical & Computer Engr
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Signal Integrity
Multilayer Interconnects
Full-Wave Analysis
Finite Element Method
Fast Frequency Sweep
Domain Decomposition
Abstract:Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell's equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.
Issue Date:2013-02-03
Rights Information:Copyright 2012 Tianjian Lu
Date Available in IDEALS:2013-02-03
Date Deposited:2012-12

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