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Title:Efficient Heat Extraction through Transfer Printed Diamond Heat Spreader
Author(s):Won, Sang M.
Contributor(s):Rogers, John A.
Subject(s):flexible electronics
stretchable electronics
materials integration
transfer printing
thermal management
Abstract:3-D heterogeneous integration (3DHGI) of different materials has great potential for electronic applications such as flexible and stretchable circuits, and multilayer solar cells. Here, we demonstrate heterogeneous integration of ultrananocrystalline diamond (UNCD) with silicon using transfer-printing. Using this approach we demonstrate dramatically improved heat extraction from the silicon layer. This 3D heterogeneously integrated system can offer superior thermal management for high power electronics such as GaN HEMT-based power amplifiers.
Issue Date:2009-05
Genre:Other
Type:Text
Language:English
URI:http://hdl.handle.net/2142/47057
Publication Status:unpublished
Peer Reviewed:not peer reviewed
Date Available in IDEALS:2014-01-24


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