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|Title:||A mechanistic study of copper electrodeposition by fractal and scaling analysis of quasi-2-dimensional images|
|Author(s):||Colburn, Andrew Albert|
|Department / Program:||Chemistry|
|Degree Granting Institution:||University of Illinois at Urbana-Champaign|
|Subject(s):||Thesis -- UIUC|
|Description:||Thesis (B.S.)--University of Illinois at Urbana-Champaign, 1999.
Includes bibliographical reference (leaves 119-122)
|Rights Information:||Copyright 1999 Colburn, Andrew Albert.|
|Date Available in IDEALS:||2014-03-20|
|Identifier in Online Catalog:||5358912|