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Title:The effect of organic additives on thin-layer electrodeposits of copper
Author(s):Brown, Michael D.
Department / Program:Chemical Engineering
Discipline:Chemical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Genre:Thesis
B.S.
Subject(s):Thesis -- UIUC
Issue Date:1997
Type:Text
Language:English
Description:Thesis (B.S.)--Univeristy of Illinois at Urbana-Champaign, 1997.
Includes bibliographical reference.
URI:http://hdl.handle.net/2142/47897
Rights Information:Copyright 1997 Brown, Michael D.
Date Available in IDEALS:2014-03-20
Date Deposited:1997
Identifier in Online Catalog:5313381
OCLC Identifier:(OCoLC)ocm85825208


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