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Title:Formation of three-dimensional graphene structures by controlled thermal activation of polymeric shape memory substrates
Author(s):Wang, Cai Mike
Advisor(s):Nam, SungWoo
Department / Program:Mechanical Sci & Engineering
Discipline:Mechanical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:M.S.
Genre:Thesis
Subject(s):graphene
graphite
shape memory polymer
polystyrene
Shrinky-Dinks
graphene-polymer composites
strain engineering
2D nano-materials
low dimensional nano-materials
atomic force microscopy (AFM)
Raman spectroscopy
surface enhanced Raman spectroscopy (SERS)
near-field scanning optical microscopy (NSOM)
plasmonics
graphene devices
flexible devices
bio-sensors
cell morphology
cell registry
Infrared (IR)
thermal treatment
chemical vapour deposition (CVD)
graphene synthesis
graphene transfer
crumples
corrugations
wrinkles
folds
buckles
ripples
surface relief grating
lithography-free patterning
soft materials
Abstract:This thesis details methodologies for a single-step approach to realise heterogeneous, three-dimensional (3D) texturing of graphene and graphite by using thermally-activated shape-memory polymers as the underlying substrate and the material characterizations thereof. Uniform, large area arrays of textured 3D graphene crumple features can be created on the centimeter scale by controlling simple processing parameters without compromising graphene’s superior mechanical, electrical, and optical properties. In addition, the capability to deterministically pattern graphene and graphite crumples in a spatially selective manner from otherwise flat graphene/graphite is achieved via infrared activation, which has not been previously possible with other methods such as relaxation of mechanically pre-strained elastomers, contraction of solvent swollen hydrogels, or thermal expansion mismatch between the surface film and substrate. The proposed methods will enable facile large-scale topographical and strain engineering of not only graphene and graphite but also other low-dimensional, thin-film and 2D materials such as transitional metal dichalcogenides and furthermore provide a pathway to realizing 3D all carbon-based devices and sensors.
Issue Date:2014-09-16
URI:http://hdl.handle.net/2142/50419
Rights Information:Copyright 2014 Cai Mike Wang
Date Available in IDEALS:2014-09-16
2016-09-22
Date Deposited:2014-08


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