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Title:Statistical Analysis of the Fiber Weave Effect over Differential Microstrips on Printed Circuit Boards
Author(s):Zhang, Tong
Contributor(s):Cangellaris, Andreas
Subject(s):Fiber weave effect
statistical analysis
differential microstrips
intra-pair time skew
Abstract:Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties; hence, as data rate increases and structure feature-size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This thesis proposes a systematic way of modeling the fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of the fiber weave effect on intra-pair skew of differential microstrip lines.
Issue Date:2014-05
Genre:Other
Type:Text
Language:English
URI:http://hdl.handle.net/2142/55635
Date Available in IDEALS:2014-10-31


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