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Evolution of surface waviness in thin films via volume and surface diffusion

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Title: Evolution of surface waviness in thin films via volume and surface diffusion
Author(s): Panat, Rahul P.; Hsia, K. Jimmy; Cahill, David G.
Subject(s): Surface diffusion
Abstract: Deformation mechanisms involving mass transport by stress driven diffusion influence a large number of technological problems. We study the formation of undulations on surfaces of stressed films at high temperature by exploring the deformation kinetics governed by volume and surface diffusion. A governing equation is derived that gives the amplitude change of such surfaces as a function of time. A parametric study is then carried out using a range of practically important input values of the film material properties. The results show that at the dominant instability wavelength, under high average stresses (giga pascal range), only surface diffusion contributes to film surface morphology evolution whereas under low stress and high-temperature conditions, both surface diffusion and volume diffusion contribute to film surface morphology evolution. Furthermore, the contribution of volume diffusion depends on the sign of the film stress, with compressive stress promoting surface roughening and tensile stress promoting surface smoothing.
Issue Date: 2005
Publisher: American Institute of Physics
Citation Info: The following article appeared in Rahul P. Panat, K. Jimmy Hsia, and David G. Cahill. (2005) Evolution of surface waviness in thin films via volume and surface diffusion. Journal of Applied Physics, 97:13521 and may be found at http://link.aip.org/link/?jap/97/13521
Genre: Article
Type: Text
Language: English
URI: http://hdl.handle.net/2142/702
DOI: 10.1063/1.1827920
Publication Status: published
Peer Reviewed: is peer reviewed
Rights Information: Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.
Date Available in IDEALS: 2007-05-10
 

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