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Title:Design of aromatic thermosetting polyester composites for thermally stable devices
Author(s):Guo, Mengxi
Advisor(s):Economy, James
Department / Program:Materials Science & Engineerng
Discipline:Materials Science & Engr
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):aromatic thermosetting polyester
printed circuit boards
Abstract:Aromatic thermosetting copolyester (ATSP) has been under development since 1995 in Professor James Economy’s research group at the University of Illinois, Urbana-Champaign. It can be seen as a major development in high performance polymers as it affords a highly processable series of routes towards diverse form factors that may need to utilize a highly thermally resistant (and therefore all-aromatic) thermosetting polymer. Prior and current study has demonstrated its outstanding thermal stability and resistance to flame, capability of ablation and high wear resistance. It shows strong bonding with fibers and thus ATSP can be used as resin matrix in polymer/fiber composites. ATSP is soluble in a number of polar aprotic solvents and can be in this regard used as an effective tribological and corrosion coating for metal components. The two-step synthesis of the ATSP is an effective and smooth synthesis that affords an immense range of tailorability both in terms of cross-link density and constituent monomers. In this thesis, firstly, new aromatic monomers, such as resorcinol diacetate and 3, 5-diacctoxybenzoic acid, are employed in the synthesis of ATSP oligomers. These have the effect of reducing condensation reaction temperature and the viscosity of the oligomer and its solutions. In the thesis, firstly, several new aromatic monomers are added to the ATSP synthesis. The condensation reaction temperature reduces and the viscosity of the oligomer solution significantly drops. Secondly, H1-NMR is introduced into the characterization. Average molecular weight of each batch of oligomers can be calculated by a simple relationship. Origins of liquid crystalline feature are discussed and more oligomers are synthesized. After reviewing the work on ATSP/carbon fiber composites, ATSP/glass fiber composite was fabricated. The thickness of the composite laminate can be easily controlled by bonding cured thin laminate together in a solid-state manner. The interlaminar shear strength of ATSP/glass fiber is measured by single fiber fragmentation test. Fiber induced local orientation of ATSP is observed. ITR process is proved to be effective in repairing the cracks and scratches of composites. In addition, the first electrical property test is achieved on ATSP/glass fiber composite. The insertion loss is less than standard circuit board FR-4.
Issue Date:2015-01-21
Rights Information:Copyright 2014 Mengxi Guo
Date Available in IDEALS:2015-01-21
Date Deposited:2014-12

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