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Title:Wafer Bonding With Low-Temperature Grown Compound Semiconductor Materials for Optoelectronic Device Application
Author(s):Chang, Kuo-Lih
Doctoral Committee Chair(s):Hsieh, K.C.
Department / Program:Electrical Engineering
Discipline:Electrical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Materials Science
Abstract:Finally, I developed two methods to transfer a GaAs-based device layer on a transparent GaP substrate (for emission wavelength longer than 560 nm), which involve multiple processing techniques. One approach also includes the regrowth step, which further indicates the bonded sample can further be processed at high temperatures.
Issue Date:2003
Type:Text
Language:English
Description:75 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2003.
URI:http://hdl.handle.net/2142/80851
Other Identifier(s):(MiAaPQ)AAI3111669
Date Available in IDEALS:2015-09-25
Date Deposited:2003


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