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Title:Architecture and CAD for Nanoscale and Three-Dimensional FPGA
Author(s):Dong, Chen
Doctoral Committee Chair(s):Chen, Deming
Department / Program:Electrical and Computer Engineering
Discipline:Electrical and Computer Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Electronics and Electrical
Abstract:To maximize the potential performance gain of 3D integrated circuit architectures, an SSTA engine was developed to deal with both uncorrelated and correlated variations in 3D FPGAs. The effects of intra-die and inter-die variation are considered. Using the 3D physical design tool TPR as a base, a new 3D routing algorithm is developed, which improves the average performance of two-layer designs by over 22% and three-layer designs by over 27%.
Issue Date:2010
Type:Text
Language:English
Description:119 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2010.
URI:http://hdl.handle.net/2142/81158
Other Identifier(s):(MiAaPQ)AAI3455707
Date Available in IDEALS:2015-09-25
Date Deposited:2010


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