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Title:Temperature -Aware VLSI Design and Analysis
Author(s):Tsai, Ching-Han
Doctoral Committee Chair(s):Kang, Sung-Mo (Steve)
Department / Program:Electrical Engineering
Discipline:Electrical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Electronics and Electrical
Abstract:The algorithms and methods developed in this work provide a firm foundation upon which to construct a more effective framework for temperature-sensitive VLSI design and analysis. This work attempts to provide a comprehensive temperature- and reliability-conscious design solution for dealing with emerging thermal and reliability issues.
Issue Date:2000
Type:Text
Language:English
Description:125 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000.
URI:http://hdl.handle.net/2142/81363
Other Identifier(s):(MiAaPQ)AAI9990172
Date Available in IDEALS:2015-09-25
Date Deposited:2000


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