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Title:Design Automation for Reliable CMOS Chip Input/output Circuits
Author(s):Li, Tong
Doctoral Committee Chair(s):Kang, Sung-Mo (Steve)
Department / Program:Computer Science
Discipline:Computer Science
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Electronics and Electrical
Abstract:Thermal failure is one of the most prevalent failure mechanism during the Human Body Model (HBM) ESD stress. Previous circuit thermal model (integrator circuit) in iETSIM only applies for constant current stress. A general thermal model using convolution is developed. New techniques are proposed to implement a thermal convolver, including regionwise-exponential (RWE) approximation and recursive convolution. The efficiency of the new thermal convolver makes it feasible to simulate a CMOS circuit containing many devices within a short time.
Issue Date:1998
Type:Text
Language:English
Description:137 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998.
URI:http://hdl.handle.net/2142/81930
Other Identifier(s):(MiAaPQ)AAI9912304
Date Available in IDEALS:2015-09-25
Date Deposited:1998


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