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Title:Investigation of the Influence of a Model Additive System on Copper Electrodeposition: Integration of Experiments on the Surface Morphology Evolution With Multiscale Simulation
Author(s):Xue, Feng
Doctoral Committee Chair(s):Alkire, Richard C.
Department / Program:Chemical Engineering
Discipline:Chemical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Chemical
Abstract:In the last chapter, copper electroplating behavior on electrodeposited ruthenium surface was briefly discussed.
Issue Date:2005
Type:Text
Language:English
Description:405 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2005.
URI:http://hdl.handle.net/2142/82379
Other Identifier(s):(MiAaPQ)AAI3202187
Date Available in IDEALS:2015-09-25
Date Deposited:2005


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