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Title:Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers
Author(s):Younker, Jennifer Lauren
Doctoral Committee Chair(s):Alkire, Richard C.
Department / Program:Chemical Engineering
Discipline:Chemical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Chemical
Abstract:This thesis describes the design and execution of experiments suitable for extracting quantitative information needed for numerical simulation of the effect of plating solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved engineering methods for prediction, design, control, and optimization of electrodeposition processes for growth of thin films on foreign substrates.
Issue Date:2008
Description:130 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.
Other Identifier(s):(MiAaPQ)AAI3347567
Date Available in IDEALS:2015-09-25
Date Deposited:2008

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