Monte Carlo Simulations of the Electrodeposition of Copper From a Sulfate Solution in the Presence of Additives

Abstract

A simple copper deposition model was developed and compared to the experimental results in three ways, qualitative visual comparisons, scaling analysis of the interface width and current time curves. Parametric studies were performed to make observations about the modeled copper system. A hypothetical blocking additive was introduced into the model to see its effects on the deposition processes. The blocker additive was used to improve the filling of a trench by electrodeposition. The concentration and properties of the blocker were varied to see their effect on the trench filling. Additional hypothetical additive and multi additive systems also were tested including a surfactant, an accelerator and a multistage additive.