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Description
Title: | Monte Carlo Simulations of the Electrodeposition of Copper From a Sulfate Solution in the Presence of Additives |
Author(s): | Pricer, Timothy James |
Doctoral Committee Chair(s): | Alkire, Richard C. |
Department / Program: | Chemical Engineering |
Discipline: | Chemical Engineering |
Degree Granting Institution: | University of Illinois at Urbana-Champaign |
Degree: | Ph.D. |
Genre: | Dissertation |
Subject(s): | Engineering, Chemical |
Abstract: | A simple copper deposition model was developed and compared to the experimental results in three ways, qualitative visual comparisons, scaling analysis of the interface width and current time curves. Parametric studies were performed to make observations about the modeled copper system. A hypothetical blocking additive was introduced into the model to see its effects on the deposition processes. The blocker additive was used to improve the filling of a trench by electrodeposition. The concentration and properties of the blocker were varied to see their effect on the trench filling. Additional hypothetical additive and multi additive systems also were tested including a surfactant, an accelerator and a multistage additive. |
Issue Date: | 2000 |
Type: | Text |
Language: | English |
Description: | 281 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000. |
URI: | http://hdl.handle.net/2142/82482 |
Other Identifier(s): | (MiAaPQ)AAI9990114 |
Date Available in IDEALS: | 2015-09-25 |
Date Deposited: | 2000 |
This item appears in the following Collection(s)
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Dissertations and Theses - Chemical and Biomolecular Engineering
Dissertations and Theses - Chemical and Biomolecular Engineering -
Graduate Dissertations and Theses at Illinois
Graduate Theses and Dissertations at Illinois