Low-Temperature Silicon Thin Films for Large-Area Electronics: Device Fabrication Using Soft Lithography and Laser-Crystallization by Sequential Lateral Solidification

Jin, Hyun-Chul
Use this link to cite this item:
http://hdl.handle.net/2142/82710

Files in this item

FilesDescriptionFormat

application/pdf

application/pdf3030441.pdf (4MB)Restricted to U of Illinois		(no description provided)PDF

Description

Title:Low-Temperature Silicon Thin Films for Large-Area Electronics: Device Fabrication Using Soft Lithography and Laser-Crystallization by Sequential Lateral Solidification
Author(s):Jin, Hyun-Chul
Doctoral Committee Chair(s):Abelson, John Robert
Department / Program:Materials Science and Engineering
Discipline:Materials Science and Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Materials Science
Abstract:We have analyzed the electrical properties of SLS poly-Si films on oxidized Si wafer using the pseudo-MOSFET geometry; the majority carrier mobility is extracted from the transconductance. However, the data are non-ideal due to large contact resistance and current spreading. We discuss the future use of these electrical characterization techniques to analyze the properties of individual grain boundaries in thin film Si bicrystals formed by SLS.
Issue Date:2001
Type:Text
Language:English
Description:109 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.
URI:http://hdl.handle.net/2142/82710
Other Identifier(s):(MiAaPQ)AAI3030441
Date Available in IDEALS:2015-09-25
Date Deposited:2001


This item appears in the following Collection(s)

Item Statistics