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Title:Design of Novel High Temperature Thermosetting Resins Tailored to Specific Needs
Author(s):Huang, Yongqing
Doctoral Committee Chair(s):Economy, James
Department / Program:Materials Science and Engineering
Discipline:Materials Science and Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Materials Science
Abstract:ATSP was applied as a high temperature adhesive for copper foils in order to improve the performance and the reliability of microelectronic devices. Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.
Issue Date:2004
Description:194 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.
Other Identifier(s):(MiAaPQ)AAI3199206
Date Available in IDEALS:2015-09-25
Date Deposited:2004

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