Design of Improved Polyester Dielectric Insulators for Electronic Packaging

Abstract

First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to improve the dimensional stability is elucidated. Lastly, a description of a new photosensitive copolyester dielectric insulator is presented.