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Title:Aluminum/titanium Nitride Metal/diffusion-Barrier Systems: Interfacial Reaction Paths and Kinetics as a Function of Microstructure and Texture
Author(s):Chun, Jin-Sung
Doctoral Committee Chair(s):Greene, J.E.
Department / Program:Materials Science and Engineering
Discipline:Materials Science and Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Materials Science
Abstract:Based upon overall results, this research establishes that dense 111-textured Al/TiN bilayers exhibit much higher thermal stability than dense 002-textured A/TiN bilayers which are, in turn, more stable than the underdense Al/TiN bilayers currently used in industry. I have demonstrated that the primary reason for the enhancement in thermal stability is the higher structural quality of the interfacial reaction product AlN which serves as a blocking layer for further reactions. Therefore, optimizing the quality and structural integrity of the AlN layer through texture and microstructure control of the TiN diffusion barrier is key to enhancing the thermal stability of the Al/TiN interface.
Issue Date:2000
Description:171 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000.
Other Identifier(s):(MiAaPQ)AAI9971052
Date Available in IDEALS:2015-09-25
Date Deposited:2000

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