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Description
Title: | Aluminum/titanium Nitride Metal/diffusion-Barrier Systems: Interfacial Reaction Paths and Kinetics as a Function of Microstructure and Texture |
Author(s): | Chun, Jin-Sung |
Doctoral Committee Chair(s): | Greene, J.E. |
Department / Program: | Materials Science and Engineering |
Discipline: | Materials Science and Engineering |
Degree Granting Institution: | University of Illinois at Urbana-Champaign |
Degree: | Ph.D. |
Genre: | Dissertation |
Subject(s): | Engineering, Materials Science |
Abstract: | Based upon overall results, this research establishes that dense 111-textured Al/TiN bilayers exhibit much higher thermal stability than dense 002-textured A/TiN bilayers which are, in turn, more stable than the underdense Al/TiN bilayers currently used in industry. I have demonstrated that the primary reason for the enhancement in thermal stability is the higher structural quality of the interfacial reaction product AlN which serves as a blocking layer for further reactions. Therefore, optimizing the quality and structural integrity of the AlN layer through texture and microstructure control of the TiN diffusion barrier is key to enhancing the thermal stability of the Al/TiN interface. |
Issue Date: | 2000 |
Type: | Text |
Language: | English |
Description: | 171 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000. |
URI: | http://hdl.handle.net/2142/82926 |
Other Identifier(s): | (MiAaPQ)AAI9971052 |
Date Available in IDEALS: | 2015-09-25 |
Date Deposited: | 2000 |
This item appears in the following Collection(s)
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Dissertations and Theses - Materials Science and Engineering
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Graduate Dissertations and Theses at Illinois
Graduate Theses and Dissertations at Illinois