Files in this item

FilesDescriptionFormat

application/pdf

application/pdf3153333.pdf (13MB)Restricted to U of Illinois
(no description provided)PDF

Description

Title:Compliant Meso-Scale Grinding of Silicon
Author(s):Jiang, Bo
Doctoral Committee Chair(s):Philpott, Michael L.; Shannon, Mark A.
Department / Program:Mechanical Engineering
Discipline:Mechanical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:Ph.D.
Genre:Dissertation
Subject(s):Engineering, Materials Science
Abstract:To further improve form accuracy obtained on the compliant grinding apparatus, a normal grinding force model and a depth of cut model were developed to account for the large compliance in the grinding system. Numerical simulation was performed to predict actual depths of cut and the results were within 6% of the measured/actual depths.
Issue Date:2004
Type:Text
Language:English
Description:186 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2004.
URI:http://hdl.handle.net/2142/83813
Other Identifier(s):(MiAaPQ)AAI3153333
Date Available in IDEALS:2015-09-25
Date Deposited:2004


This item appears in the following Collection(s)

Item Statistics