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Title:In-Situ Micro Testing Techniques for Electro-Thermo-Mechanical Characterization of Nano/micro-Scale Materials
Author(s):Han, Jong Hee
Doctoral Committee Chair(s):Saif, M. Taher A.
Department / Program:Mechanical Engineering
Discipline:Mechanical Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Mechanical
Abstract:100-nm-thick Al films deposited at two different conditions and having different grain sizes were compared for their thermal behavior by in-situ TEM annealing. The sample having grain size of 250 nm showed grain growth while that with 55-nm grains displayed no grain growth up to melting. The difference is attributed to larger concentration of oxygen in the latter sample. However, when the film having 55-nm grain size was interfaced with a SiO 2 layer, grain growth was seen near the melting, possibly because of the increased stress induced from thermal mismatch. Also, 4-point electrical resistance measurement was performed on 100-nm thick Al film. Its temperature-dependent response was normal metallic linear behavior except that the initial resistivity was about 10 times higher than the bulk value.
Issue Date:2007
Description:133 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.
Other Identifier(s):(MiAaPQ)AAI3290243
Date Available in IDEALS:2015-09-25
Date Deposited:2007

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