Delamination of Thin Film Patterns Using Laser-Induced Stress Waves

Abstract

A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.