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Title:Delamination of Thin Film Patterns Using Laser-Induced Stress Waves
Author(s):Kandula, Soma Sekhar Venkata
Doctoral Committee Chair(s):Sottos, Nancy R.
Department / Program:Aerospace Engineering
Discipline:Aerospace Engineering
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Mechanical
Abstract:A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.
Issue Date:2008
Description:100 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.
Other Identifier(s):(MiAaPQ)AAI3314811
Date Available in IDEALS:2015-09-25
Date Deposited:2008

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