Files in this item



application/pdf9996682.pdf (6MB)Restricted to U of Illinois
(no description provided)PDF


Title:Dimensional Stability of Multilayer Circuit Boards
Author(s):Shrotriya, Pranav
Doctoral Committee Chair(s):Sottos, Nancy R.
Department / Program:Theoretical and Applied Mechanics
Discipline:Theoretical and Applied Mechanics
Degree Granting Institution:University of Illinois at Urbana-Champaign
Subject(s):Engineering, Materials Science
Abstract:Numerical and experimental studies are performed to study residual deformation and warpage in a model multilayer circuit board construction of a common composite substrate (7628 fabric style). A numerical procedure based on classical lamination theory with non-isothermal viscoelastic constitutive relations is developed to predict the deformation and residual stress state due to relamination. Experimental values of the substrate stress relaxation modulus and coefficients of thermal expansion (CTE) are used as inputs in the numerical procedure to predict warpage of model circuit boards with a non-symmetric lay-up of 7628 style composite substrate. Boards with the exact same construction as used in the numerical analysis were fabricated according to the prescribed pressing cycle and the time dependent warpage measured using an ultrasonic contour scan technique. Comparison of the experimental warpage data with numerical predictions provides insight into the effects of processing cycle and substrate properties on residual stress development.
Issue Date:2001
Description:141 p.
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.
Other Identifier(s):(MiAaPQ)AAI9996682
Date Available in IDEALS:2015-09-28
Date Deposited:2001

This item appears in the following Collection(s)

Item Statistics