Browse Illinois Research and Scholarship by Author "Rajagopal, M.C."

  • Rajagopal, M.C.; Man, T.; Agrawal, A.; Kuntumalla, G.; Sinha, S. (American Institute of Physics Review of Scientific Instruments, 2020-10-01)
    Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential ...


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