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Browse Dept. of Chemical and Biomolecular Engineering by Author "Qin, Yan"
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Browse Dept. of Chemical and Biomolecular Engineering by Author
Browse Dept. of Chemical and Biomolecular Engineering by Author "Qin, Yan"
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Effect of Additives and Substrate Resistance on Shape Evolution During Electrodeposition: Nucleation, Growth and Trench Infill for Copper Interconnects
Qin, Yan
(
2006
)
Cu nucleation and growth on resistive thin gold and ruthenium films was carried out in a electrochemical cell. A current pulse technique was found to produce a higher nucleation density that served to reduce the terminal ...
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