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Title:Thin-film GaN HEMTs for flexible electronics
Author(s):Perozek, Josh
Contributor(s):Bayram, Cam
Subject(s):GaN
high electron mobility transistors
flexible electronics
Abstract:As the demand for faster, more efficient, and more robust electronics continues to grow, new materials beyond silicon need to be explored. In the field of power electronics, gallium nitride (GaN) is a strong candidate for next-generation devices due to its wide bandgap (3.4 eV), high electron mobility (>1500 cm2/V-s), and large electron sheet concentration (1013 cm-2). These properties enable high-performance devices that are mechanically and electrically stable in harsh conditions such as high temperatures or extreme bending. Due to the prohibitive cost of free-standing GaN, GaN wafers are typically created through epitaxial growth on sapphire, silicon carbide, or Si (111) substrates; through substrate removal processes, the <5 μm thick GaN layers enable new thin-film technologies such as flexile electronics. In this project, we develop a wet etching based low-cost substrate removal process for GaN on Si (111) and characterize the structural and electrical properties of the material before and after substrate removal as well as at various bending conditions.
Issue Date:2017-12
Genre:Other
Type:Text
Language:English
URI:http://hdl.handle.net/2142/97881
Sponsor:AFOSR Young Investigator Program Grant/FA9550-16-1-0224
Date Available in IDEALS:2017-08-28


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