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Title:Near-field wireless power transfer to and communication with chip-scale devices
Author(s):Arakawa, Brandon E
Advisor(s):Gong, Songbin
Department / Program:Electrical & Computer Eng
Discipline:Electrical & Computer Engr
Degree Granting Institution:University of Illinois at Urbana-Champaign
Degree:M.S.
Genre:Thesis
Subject(s):Wireless power transfer
Energy harvesting
Rectifiers
Abstract:This thesis addresses the design challenges of achieving simultaneous near-field wireless power transfer to and communication with chip-scale devices that have a form factor on the order of 100s of microns and a thickness of 10s of microns. One application that requires this technology is the supply chain security for electronic components, in which a wireless chip-scale device is embedded within the package of a host electronic component in order to verify the provenance of the host as it passes through the supply chain. The need for wireless capabilities in such an application arises from the small form factor of the chip-scale device and its lack of space for a battery, while the authentication process for security assurance requires wireless data communication with the chip-scale device. Simultaneously achieving both capabilities involves the co-design of both the power and data transceivers with an optimized near-field coupling scheme. The organization of the thesis is as follows. Chapter 2 covers electromagnetic coupling theory to achieve wireless power transfer. A tri-coil design approach is introduced to improve the wireless power transfer efficiency of the link compared to traditional two-coil designs. The design is verified using simulated and measured results. Additionally, a certain kind of circuit is required to enable a chip-scale device to support simultaneous power and communication. Chapter 3 presents a rectifier topology that achieves this purpose, and a prototype circuit is fabricated and measured to validate the design concepts. Finally, in order for a chip-scale device to be commercially viable, it needs to be compatible with standard CMOS fabrication processes. Chapter 4 discusses design strategies and procedures for multiple CMOS-compatible circuits for chip-scale simultaneous wireless power transfer and communication applications.
Issue Date:2017-07-19
Type:Text
URI:http://hdl.handle.net/2142/99120
Rights Information:Copyright 2017 Brandon Arakawa
Date Available in IDEALS:2018-03-02
Date Deposited:2017-08


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