2026-09-21T14:06:02Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/109538 2023-07-11 col_2142_5131 col_2142_14787 com_2142_5130 com_2142_9630 com_2142_234

Kapoor, Shiv Gopal Cui, Yixiao 2021-03-05T21:42:53Z 2021-03-05T21:42:53Z 2023-03-05T21:43:00Z 2020-12-10 2020-12 Increasing demand for microstructure replication in the industry has led to increasing attention to hot embossing technology. The hot embossing technology has developed a lot for the past few decades and been proved to be capable to replicate microstructure with high efficiency and high accuracy. This thesis is going to establish a numerical hot embossing model that can simulate the hot embossing process. The effect of process parameters will be discussed based on the model. The optimization method for the process parameters will also be performed, which can guide the manufacturing process. Finally, a process defect diagnosis system is designed and tested with the simulation experiments of the hot embossing model. Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2022-12-01 The student, Yixiao Cui, accepted the attached license on 2020-12-09 at 12:17. The student, Yixiao Cui, submitted this Thesis for approval on 2020-12-09 at 12:17. This Thesis was approved for publication on 2020-12-10 at 16:49. DSpace SAF Submission Ingestion Package generated from Vireo submission #16105 on 2021-03-04 at 16:20:49 Made available in DSpace on 2021-03-05T21:42:53Z (GMT). No. of bitstreams: 2 CUI-THESIS-2020.pdf: 7128325 bytes, checksum: c186a38be88586bb84b7b1bcbd5c794b (MD5) LICENSE.txt: 4207 bytes, checksum: df9c2419fc19deb4738b6962f508c6fa (MD5) Previous issue date: 2020-12-10 Embargo set by: Seth Robbins for item 117243 Lift date: 2023-03-05T21:43:00Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system U of I Only application/pdf http://hdl.handle.net/2142/109538 en Copyright 2020, Yixiao Cui Hot Embossing Simulation Optimization Diagnosis ABAQUS simulation and optimization of PMMA hot embossing process text Thesis Mechanical Sci & Engineering Mechanical Engineering University of Illinois at Urbana-Champaign Thesis M.S.