2026-09-20T21:53:31Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/120574 2023-09-07 col_2142_5131 col_2142_8888 com_2142_5130 com_2142_8887 com_2142_234

Goddard, Lynford L 2023-05 application/pdf en text Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2025-05-01 The student, Jack Huang, accepted the attached license on 2023-04-28 at 14:37. The student, Jack Huang, submitted this Thesis for approval on 2023-04-28 at 14:43. This Thesis was approved for publication on 2023-05-01 at 13:45. DSpace SAF Submission Ingestion Package generated from Vireo submission #19250 on 2023-09-01 at 17:22:10 Subsurface 3D integrated photonic devices Huang, Jack 2023-05-01 Integrated Photonics Photonics Integrated Circuits Mach-zehnder Interferometers Microring Resonators Two-photon Lithography In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results. Text eng https://hdl.handle.net/2142/120574 Copyright 2023 Jack Huang M.S. Thesis Electrical & Computer Engr University of Illinois at Urbana-Champaign Electrical & Computer Eng