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        <identifier>oai:www.ideals.illinois.edu:2142/14617</identifier>
        <datestamp>2023-07-10</datestamp>
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        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Torrellas, Josep</dc:contributor>
          <dc:contributor>Torrellas, Josep</dc:contributor>
          <dc:creator>Karpuzcu, Rahmet U.</dc:creator>
          <dc:date>2010-01-06T16:19:48Z</dc:date>
          <dc:date>2010-01-06T16:19:48Z</dc:date>
          <dc:date>2010-01-06T16:19:48Z</dc:date>
          <dc:description>Many-core scaling now faces a power wall. The gap between the number of cores
that fit on a die and the number that can operate simultaneously under the power
budget is rapidly increasing with technology scaling. In future designs, the
majority of the cores will necessarily have to be dormant at any given time to
meet the power budget.  
To push back the many-core power wall, this work introduces Dynamic Voltage
Scaling for Aging Management (DVSAM) — a new scheme for trading off processor
aging for performance and power. DVSAM can be used to maximize performance,
minimize power, or boost performance for a short life.  In addition, this work
introduces the BubbleWrap many-core, an architecture that makes use of DVSAM.
BubbleWrap identifies the most power-efficient cores on a variation-affected
chip and designates them as Throughput cores dedicated to parallel-section
execution; the rest of the cores (Expendable cores) are dedicated to sequential
sections. In one use of DVSAM, BubbleWrap sacrifices Expendable cores one at a
time by running them at elevated V dd for a month or so each, until they
completely wear out. Our simulations show that a 32-core BubbleWrap many-core
provides substantial improvements over a plain chip. For example, on average,
one design runs fully sequential applications at a 22% higher frequency, and
fully parallel applications with a 33% higher throughput.</dc:description>
          <dc:description>Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2009-10-23T15:23:30Z
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University of Illinois Theses &amp; Dissertations (ID: 1)
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          <dc:identifier>http://hdl.handle.net/2142/14617</dc:identifier>
          <dc:language>en</dc:language>
          <dc:rights>@ 2009 Rahmet Ulya Karpuzcu</dc:rights>
          <dc:subject>Processor Aging</dc:subject>
          <dc:subject>Voltage Scaling</dc:subject>
          <dc:subject>Process Scaling</dc:subject>
          <dc:subject>Power Wall.</dc:subject>
          <dc:title>Managing Many-Core Aging</dc:title>
          <dc:date>2009-12</dc:date>
          <degree>
            <department>Electrical &amp; Computer Eng</department>
            <departmentCode>1933</departmentCode>
            <discipline>Electrical &amp; Computer Engr</discipline>
            <disciplineCode>1200</disciplineCode>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
            <level>Thesis</level>
            <name>M.S.</name>
            <program>PHD:Electr &amp; Computer Eng-UIUC</program>
            <programCode>10KS1200PHD</programCode>
          </degree>
        </thesis>
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