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Cangellaris, Andreas C. Sheikh, Zuhaib B. 2011-01-14T22:48:52Z 2011-01-14T22:48:52Z 2011-01-14T22:48:52Z Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy. Item withdrawn by Alexis Thompson (athmpsn1@illinois.edu) on 2010-12-02T17:21:28Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5) Made available in DSpace on 2011-01-14T22:48:52Z (GMT). No. of bitstreams: 2 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5) license.txt: 4062 bytes, checksum: 453e23e0f349762586ff0e6bc549202c (MD5) http://hdl.handle.net/2142/18390 en Copyright 2010 Zuhaib B. Sheikh Transmission Line Model Multi-conductor Interconnects Two-dimensional RLCG extractor Rational Fitting Algorithm VECTFIT HSPICE Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits 2010-12 MS:Electr & Computer Eng-UIUC 10KS1200MS Electrical & Computer Eng 1933 Electrical & Computer Engr 1200 University of Illinois at Urbana-Champaign Thesis M.S.