<?xml version="1.0" encoding="UTF-8"?>
<?xml-stylesheet type="text/xsl" href="/oai-pmh.xsl"?>
<OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd">
  <responseDate>2026-09-22T08:51:34Z</responseDate>
  <request identifier="oai:www.ideals.illinois.edu:2142/24249" metadataPrefix="etdms" verb="GetRecord">https://www.ideals.illinois.edu/oai-pmh</request>
  <GetRecord>
    <record>
      <header>
        <identifier>oai:www.ideals.illinois.edu:2142/24249</identifier>
        <datestamp>2023-07-10</datestamp>
        <setSpec>col_2142_5131</setSpec>
        <setSpec>col_2142_14787</setSpec>
        <setSpec>com_2142_5130</setSpec>
        <setSpec>com_2142_9630</setSpec>
        <setSpec>com_2142_234</setSpec>
      </header>
      <metadata>
        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Ferreira, Placid M.</dc:contributor>
          <dc:creator>Ahmed, Numair</dc:creator>
          <dc:date>2011-05-25T14:58:00Z</dc:date>
          <dc:date>2011-05-25T14:58:00Z</dc:date>
          <dc:date>2011-05-25T14:58:00Z</dc:date>
          <dc:date>2011-05</dc:date>
          <dc:description>Current microelectronics and micro-electromechanical systems (MEMS) fabrication
techniques are optimized for the production of very large volume of parts on a limited range of
substrates. These processes have been designed to produce excellent results but still consume
large amounts of time and resources and require expensive machinery and facilities. Over the
past few years many low cost, fast printing processes have begun to emerge capable of
economically producing electronics and MEMS on a variety of substrates. Examples of printed
electronic devices include sensors, organic photovoltaic, intelligent packaging, radio frequency
identification devices and flexible displays. One such process currently under development at the
University of Illinois is micro transfer printing.
Micro transfer printing is a process by which micro devices and circuit elements
fabricated using standard micro fabrication techniques are picked up and printed onto a
destination substrate using a patterned flexible elastomeric stamp. The advantages of the process
are low cost, high flexible, high through put, novel target substrates and the devices maintain
performance of the host semiconductor. Commercialization of this process depends on the
development of innovative technologies for the application of the process to fast and flexible
process paradigms realizing innovative products and the ability to integrate the process into
existing fabrication processes.
This thesis describes the theoretical and practical design of a suite of technologies
designed to increase the ease of usage, flexibility, robustness and printing capabilities of the
transfer printing tool. We present the design and construction of an instrumented stamp for
contact sensing at the device level to close the loop around the pickup and printing process and
iv
provide a means of feedback. This method has provided an alternative to detect process events
and has also been shown to provide means of diagnosing the process as it is running. Along with
the instrumented stamps a remote center of compliance tip tilt stage used to perform alignment
with minimal loss of registration was also designed and developed for the transfer printer.</dc:description>
          <dc:description>Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2011-04-28T19:36:24Z
Item was in collections:
University of Illinois Theses &amp; Dissertations (ID: 1)
No. of bitstreams: 1
Towards Active Monitoring of The Micro Transfer Printing Process.pdf: 2542977 bytes, checksum: d8c8683967043afdcbeab4d351c44c85 (MD5)</dc:description>
          <dc:description>Made available in DSpace on 2011-05-25T14:58:00Z (GMT). No. of bitstreams: 2
Ahmed_Numair.pdf: 3156835 bytes, checksum: e36521a9acc0a401376a96edf8d0a597 (MD5)
license.txt: 4061 bytes, checksum: 4deb6ebe84177dc0daf9c95644b0d686 (MD5)</dc:description>
          <dc:identifier>http://hdl.handle.net/2142/24249</dc:identifier>
          <dc:language>en</dc:language>
          <dc:rights>Copyright 2011 Numair Ahmed</dc:rights>
          <dc:subject>Micro Transfer Printing</dc:subject>
          <dc:subject>Heterogeneous Integration</dc:subject>
          <dc:title>Towards Active Monitoring of The Micro Transfer Printing Process</dc:title>
          <degree>
            <department>Mechanical Sci &amp; Engineering</department>
            <departmentCode>1917</departmentCode>
            <discipline>Mechanical Engineering</discipline>
            <disciplineCode>0133</disciplineCode>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
            <level>Thesis</level>
            <name>M.S.</name>
            <program>MS:Mechanical Engineerng -UIUC</program>
            <programCode>10KS0133MS</programCode>
          </degree>
        </thesis>
      </metadata>
    </record>
  </GetRecord>
</OAI-PMH>
