2026-09-21T11:09:51Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/24476 2023-07-10 col_2142_5131 col_2142_14787 com_2142_5130 com_2142_9630 com_2142_234

Yu, Min-Feng Yu, Min-Feng Ferreira, Placid M. King, William P. Kim, Kyekyoon Hu, Jie 2011-05-25T14:24:24Z 2013-05-26T10:00:18Z 2011-05-25T14:24:24Z 2011-05 A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes in an ambient air environment. This technique is cost-effective to implement and is based on the principle of electrodeposition, and can thus be applied to fabricate structures made of a wide variety of materials. In this work, theoretically, a detailed analysis was provided for describing the growth parameters essential for the meniscus-confined electrodeposition process; experimentally, various techniques were developed to fabricate structures with demanding shapes and dimensions for specific electrical and electrochemical applications. Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2011-03-22T12:50:03Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 HU_JIE.pdf: 12554650 bytes, checksum: e5aca42e01d52296d219e529736e84ef (MD5) Made available in DSpace on 2011-05-25T14:24:24Z (GMT). No. of bitstreams: 2 HU_JIE.pdf: 12554650 bytes, checksum: e5aca42e01d52296d219e529736e84ef (MD5) license.txt: 4054 bytes, checksum: 21b14c60f230c7632614929be1c288a2 (MD5) Item marked as restricted to the 'Administrator' Group (id=1) by William Ingram (wingram2@illinois.edu) on 2011-05-25T14:29:54Z Item is restricted until 2013-05-25T14:29:35Z Item reinstated by Sarah Shreeves (sshreeve@illinois.edu) on 2013-05-26T10:00:18Z Item was in collections: University of Illinois Dissertations and Theses (ID: 204) Dissertations and Theses - Mechanical Science and Engineering (ID: 675) No. of bitstreams: 3 HU_JIE.pdf: 12554650 bytes, checksum: e5aca42e01d52296d219e529736e84ef (MD5) license.txt: 4054 bytes, checksum: 21b14c60f230c7632614929be1c288a2 (MD5) HU_JIE.pdf.txt: 154005 bytes, checksum: ec010246f82aeea402da501952af92c3 (MD5) Item released from any restrictions by Sarah Shreeves (sshreeve@illinois.edu) on 2013-05-26T10:00:18Z http://hdl.handle.net/2142/24476 en Copyright 2011 Jie Hu Meniscus-confined Electrodeposition Nanoprobes Wire Bonding 3-D Structures Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures Mechanical Sci & Engineering 1917 Mechanical Engineering 0133 University of Illinois at Urbana-Champaign Dissertation Ph.D. PHD:Mechanical Enginerng -UIUC 10KS0133PHD