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        <identifier>oai:www.ideals.illinois.edu:2142/30775</identifier>
        <datestamp>2023-07-10</datestamp>
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        <setSpec>col_2142_5131</setSpec>
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        <thesis xmlns="http://www.ndltd.org/standards/metadata/etdms/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.ndltd.org/standards/metadata/etdms/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdms11.xsd http://purl.org/dc/elements/1.1/ http://www.ndltd.org/standards/metadata/etdms/1.1/etdmsdc.xsd">
          <dc:contributor>Gibson, J. Murray</dc:contributor>
          <dc:creator>Chen, Xidong</dc:creator>
          <dc:date>2012-04-26T22:31:26Z</dc:date>
          <dc:date>2012-04-26T22:31:26Z</dc:date>
          <dc:date>10000-01-01</dc:date>
          <dc:date>1997</dc:date>
          <dc:description>The Si/Si02 interface roughness has important effects on the performance of metal-oxide semiconductor
field effect transistor devices, which dominate contemporary integrated circuit
technology. There have been intense efforts to study this system due to its importance. In this
work, a new transmission electron microscope technique has been developed to study the interface
roughness of Si/Si02 Interfaces between Si and furnace grown Si02 layers can be unambiguously
imaged with this technique, hence rich information on interface roughness can be obtained. The
basic principle and related issues of this technique are discussed. The main character of random
roughness is also reviewed. With this technique, the effect of post -oxidation annealing on
Si(l00)/Si02 and Si(lll)/Si02 interface roughness has been investigated. It was found that as grown
~6mm thick silicon(lOO) dioxides generate a very high roughness (σ ~ 10- 15A). However,
this roughness can be removed by short annealing in nitrogen at the growth temperature of 900° C.
A growth model for silicon oxidation is proposed to understand this dramatic effect of postoxidation
annealing at the unusually low temperature of 900°  C. Roughness parameters such as
correlation length and root-mean-square roughness are related to oxidation rate and diffusion
constant in this model. The effect of chemical processing on the starting surface of silicon was also
studied. Other related issues such as imaging processing, the</dc:description>
          <dc:description>Submitted by William Weathers (weathrs2@illinois.edu) on 2012-04-26T22:31:26Z
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  Previous issue date: 1997</dc:description>
          <dc:description>Restriction data tranferred 2014-07-01T11:33:03-05:00
Original Data
Group with Access UIUC Users [automated]
Release Date: none
Reason: Thesis</dc:description>
          <dc:description>Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by William Weathers (weathrs2@illinois.edu) on 2012-04-26T22:31:26Z
Item is restricted indefinitely.</dc:description>
          <dc:description>Thesis</dc:description>
          <dc:description>U of I Only</dc:description>
          <dc:identifier>http://hdl.handle.net/2142/30775</dc:identifier>
          <dc:identifier>4055727</dc:identifier>
          <dc:language>en</dc:language>
          <dc:rights>©1997 Chen</dc:rights>
          <dc:subject>interface roughness</dc:subject>
          <dc:subject>Si/SiO2</dc:subject>
          <dc:subject>metal-oxidesemiconductor field effect transistor</dc:subject>
          <dc:subject>integrated circuits</dc:subject>
          <dc:subject>post -oxidation annealing</dc:subject>
          <dc:subject>Si(l00)/Si02</dc:subject>
          <dc:subject>Si(lll)/Si02</dc:subject>
          <dc:title>The Si/SiO2 Interface Roughness</dc:title>
          <dc:type>Dissertation / Thesis</dc:type>
          <dc:type>text</dc:type>
          <degree>
            <department>Physics</department>
            <discipline>Physics</discipline>
            <disciplineCode>University of Illinois at Urbana-Champaign</disciplineCode>
            <level>Dissertation</level>
            <name>Ph.D.</name>
          </degree>
        </thesis>
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