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        <identifier>oai:www.ideals.illinois.edu:2142/81129</identifier>
        <datestamp>2023-07-11</datestamp>
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          <dc:contributor>Chew, Weng Cho</dc:contributor>
          <dc:creator>Qian, Zhiguo</dc:creator>
          <dc:date>2015-09-25T20:09:41Z</dc:date>
          <dc:date>2015-09-25T20:09:41Z</dc:date>
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          <dc:date>2009</dc:date>
          <dc:date>2009</dc:date>
          <dc:description>Several fundamental aspects of the surface integral equation (SIE) method including the low-frequency breakdown, the skin effect, and the substrate effect, have been addressed for full-wave electromagnetic analysis in the low-frequency regime, especially the modeling of electrical interconnects on chip and package levels. The augmentation technique is a simple and efficient remedy for the low-frequency breakdown, which is the bottleneck of the broadband simulation. Based on the augmented formulations, very complicated problems in the real world can be efficiently solved with appropriate preconditioning and fast algorithm acceleration. As required in many applications, a generalized impedance boundary condition (GIBC) formulation is developed to handle the skin effect rigorously and efficiently. It degenerates into traditional methods with two steps of approximations. These new techniques are also combined together into a comprehensive formulation to cover both the skin effect and the substrate effect without any low-frequency instability.</dc:description>
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  Previous issue date: 2009</dc:description>
          <dc:description>Embargo set by: Seth Robbins for item 82411
Lift date: Forever
Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs</dc:description>
          <dc:description>U of I Only</dc:description>
          <dc:description>111 p.</dc:description>
          <dc:description>Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2009.</dc:description>
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          <dc:identifier>(MiAaPQ)AAI3363061</dc:identifier>
          <dc:language>eng</dc:language>
          <dc:subject>Engineering, Electronics and Electrical</dc:subject>
          <dc:title>Augmented Surface Integral Equation Method for Low-Frequency Electromagnetic Analysis</dc:title>
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            <department>Electrical and Computer Engineering</department>
            <discipline>Electrical and Computer Engineering</discipline>
            <grantor>University of Illinois at Urbana-Champaign</grantor>
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            <name>Ph.D.</name>
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