2026-09-20T12:23:37Z https://www.ideals.illinois.edu/oai-pmh

oai:www.ideals.illinois.edu:2142/81220 2023-07-11 col_2142_5131 col_2142_8888 com_2142_5130 com_2142_8887 com_2142_234

Seth Hutchinson Castano, Rebecca L. 2015-09-25T20:10:06Z 2015-09-25T20:10:06Z 10000-01-01 1998 1998 We present improved yield models that can be used for a broader range of printed patterns. We also enhance the defect geometry models that are commonly used today. We introduce a defect geometry model that is based on the physical process of defect formation. Our defect geometry model employs Markov random fields to represent more general defect shapes. Yield is estimated using Monte Carlo sampling methods. Finally, we present methods for estimating the parameters of the yield models using observed data from the manufacturing process. Made available in DSpace on 2015-09-25T20:10:06Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9834658.pdf: 5664009 bytes, checksum: d9eaa758caeb497ab1fe9db34615608e (MD5) Previous issue date: 1998 Embargo set by: Seth Robbins for item 82501 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 129 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998. http://hdl.handle.net/2142/81220 (MiAaPQ)AAI9834658 eng Engineering, Packaging Models for Yield Estimation of Multichip Module Ceramic Substrates text Electrical Engineering Electrical Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.