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oai:www.ideals.illinois.edu:2142/81291 2023-07-11 col_2142_5131 col_2142_8888 com_2142_5130 com_2142_8887 com_2142_234

Hsieh, Kuang-Chien Flachsbart, Bruce 2015-09-25T20:10:25Z 2015-09-25T20:10:25Z 10000-01-01 1999 1999 Basic techniques used for the integration and precise self-alignment of optoelectronic components are presented. State-of-the-art self-alignment accuracies have been achieved using solder bump arrays for component alignment and etched V-grooves for optical fiber alignment. The self-alignment potential of eutectic tin-silver solder bump arrays to produce sub-quarter-micron alignment precision is demonstrated. The potential for V-groove dimensional control to enable sub-half-micron optical fiber positioning is also demonstrated. Optimal materials and conditions are discussed. Novel fabrication procedures are presented, such as the use of an adhesion layer to facilitate solder reflow and a V-groove planarization process to facilitate planar processing. The combination of these techniques for the integration of optoelectronic components with the provision of mutual alignment between them is also discussed. Made available in DSpace on 2015-09-25T20:10:25Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9944851.pdf: 4092562 bytes, checksum: 62c9c85a619818a6ccb0a57bf5227f86 (MD5) Previous issue date: 1999 Embargo set by: Seth Robbins for item 82572 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs U of I Only 83 p. Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1999. http://hdl.handle.net/2142/81291 (MiAaPQ)AAI9944851 eng Engineering, Metallurgy Precision Self -Alignment Techniques for Optoelectronic Integration text Electrical Engineering Electrical Engineering University of Illinois at Urbana-Champaign Dissertation Ph.D.